
"We recently completed our $25 million private placement, and we continue to work with Merrill Lynch on their due diligence to lend us the additional capital we need to finance the construction of our polysilicon facility in Pocatello, Idaho," said Dustin Shindo, Chief Executive Officer of Hoku Scientific. "Extending the financing deadlines in our customer contracts reduces some of the time pressure to complete the financing. We appreciate the continuing support from Global Expertise Wafer Division of our planned polysilicon business."
In December, 2007, Hoku Scientific announced that it had signed a non-binding term sheet with Merrill Lynch Pierce Fenner & Smith Inc. for Hoku Materials to borrow up to approximately $185 million for the construction, procurement and start-up of its planned polysilicon production plant in Pocatello, Idaho. The term sheet expires on May 31, 2008. In February, Hoku Scientific completed the private placement of approximately $25 million of its common stock to institutional investors and a subsidiary of Suntech Power Holdings Co., Ltd.
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